Fan out packaging types and characteristics

Fan out packaging refers to the packaging form in which multiple transistors or other electronic components with different functions are packaged together to form an independent functional unit, and connected to external circuits through pins. This packaging form can greatly simplify circuit board design and wiring work, while improving the overall integration and reliability of the circuit.



The characteristics of fanout packaging
Fan out packaging has the following significant characteristics:

High Integration: Fan out packaging can integrate multiple electronic components into one packaging device, achieving highly integrated circuit design.

Small size: Compared to dispersed electronic components, fanout packaging can significantly reduce the size of circuit boards and save space.

Easy to maintain: Through fanout packaging, circuit maintenance and replacement work can be simplified, improving equipment maintainability.

Optimized wiring: Fan out packaging can reduce circuit wiring complexity, reduce signal transmission path length, and improve circuit performance.



Types of Fan Out Packaging
Fan out packaging can be classified into various types based on its structure and purpose, commonly including:

DIP (Dual In Line Package): The most common fanout packaging form, with pins arranged in a straight row, suitable for various digital integrated circuits.

SOIC (Small Profile Integrated Circuit Package): A fanout package manufactured using surface mount technology, suitable for high-density integrated circuit design.

QFP (Square Flat Chip Package): The pins are arranged in a square shape, suitable for high-end digital signal processing chips.

BGA (Ball Grid Array Package): The pins are fixed at the bottom of the package with spherical solder joints, suitable for high-performance microprocessors and other chips.

TSSOP (Extremely Thin Small Profile Package): The package is compact and slim, suitable for compact space design.



Application fields of fanout packaging
Fan out packaging is widely used in various fields and industries, mainly including but not limited to the following aspects:

Consumer electronics products: Fan out packaging is widely used in consumer electronics products such as smartphones, tablets, and digital cameras.

Computer hardware: High performance computer chips such as CPU, GPU, and memory are integrated using fanout packaging.

Communication equipment: The digital signal processors in communication equipment such as routers, switches, and base stations are packaged in a fanout type.

Automotive electronics: Fan out packaging is commonly used in automotive electronic products such as control modules and driving assistance systems to achieve high performance and reliability.

Industrial control: The digital circuit modules in industrial control equipment such as PLC (Programmable Logic Controller), sensors, and actuators are packaged in fanout type.

Medical equipment: Digital processing units in medical diagnostic instruments, monitoring equipment, and other medical equipment are often packaged in a fanout type.

The application of fanout packaging in the above fields enables electronic products to have higher performance, smaller size, more optimized layout design, while also improving production efficiency and reliability, bringing great convenience to modern technology.